TIN PLATING :
HOW TO INCREASE SOLDERABILITY SHELF LIFE ?
Normally we do tin plating for soldering and contact purpose .Here I am writing about tin plating on copper and copper alloys only . When we do soldering After tin plating , Soldering will be very nice . Then we assessed the tin plating part is good . Same parts we pack & supply or keep in store for some weeks or months . After that customer found that tin plated component got discolour and soldering not getting proper . Then they start blaming to platers for faulty tin plating . In this situation parts manufacturer and plater both will be in problem.
When plater did the tin plating that time soldering was good but after some time soldering failed . It means soldering shelf life of components is very less .
REASONS OF PROBLEM
Normally this problem occur due to copper diffusion and intermetallic layer formation between tin and copper , which can grow to reach the surface of tin coating and this will reduce the solderability shelf life .
NICKEL UNDERCOAT IS THE SOLUTION
Copper diffusion and Intermetallic layer formation between tin and copper is very fast . To enhance the solderability shelf life of components nickel undercoat between copper and tin is must . Intermetallic layer formation between tin and nickel is slow compare to tin and copper .
RELATED POSTS :
TIN PLATING
TIN PLATING : EFFECTS OF BRIGHTENERS & ADDITIVES
HOW TO INCREASE SOLDERABILITY SHELF LIFE ?
Normally we do tin plating for soldering and contact purpose .Here I am writing about tin plating on copper and copper alloys only . When we do soldering After tin plating , Soldering will be very nice . Then we assessed the tin plating part is good . Same parts we pack & supply or keep in store for some weeks or months . After that customer found that tin plated component got discolour and soldering not getting proper . Then they start blaming to platers for faulty tin plating . In this situation parts manufacturer and plater both will be in problem.
When plater did the tin plating that time soldering was good but after some time soldering failed . It means soldering shelf life of components is very less .
REASONS OF PROBLEM
Normally this problem occur due to copper diffusion and intermetallic layer formation between tin and copper , which can grow to reach the surface of tin coating and this will reduce the solderability shelf life .
NICKEL UNDERCOAT IS THE SOLUTION
Copper diffusion and Intermetallic layer formation between tin and copper is very fast . To enhance the solderability shelf life of components nickel undercoat between copper and tin is must . Intermetallic layer formation between tin and nickel is slow compare to tin and copper .
RELATED POSTS :
TIN PLATING
TIN PLATING : EFFECTS OF BRIGHTENERS & ADDITIVES
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